Electronic and Semi Conductor Industry

The manufacture of precious metal or wafers in silicon or a range of materials requires the manufacturing equipment and seed wafers to be profiled with pure and consistent materials. Our range of surface finishing equipment and specialist media is suited to this application.  The manufacture of electronic components and circuit boards can utilise a range of surface finishing application processes such as wet blast plastic media stripping, and we supply systems and media specifically for this application. 

 In addition to manufacturing, the need for repair and maintenance of electronic components can also lead to the need to remove and strip PCB (printed circuit boards), which requires removal of layers of conformal coatings and other protective layers.  Plastic media is ideally suited to this application and we offer the equipment, media and services to conduct these operations.